Quality Control System

Quality Policy

  • Quality, Efficiency, and Service

Environment Policy

  • Strictly obey the legislation and regulations for pollution prevention.
  • Continually improve the processes for saving resource usage.
  • Progressively manufacture environment-protected products for the benefit of human society

Health and Safety Policy

  • Strictly obey the legislation and regulations for employee health and safety.
  • Continually create a healthy and safe working environment.
  • Progressively prevent the potential risk of endangering health and safety.

Quality

  • 100% visual inspection and electrical test
  • Test data
  • IPC
  • Certification – ISO 9001
  • XRF test data
  • Solderability test
  • Impedance modeling/testing

Items

Descriptions

1. IQC

Incoming Quality Control for incoming raw material and Incoming Subcontract semi-products

2. IPQC

In-process quality control, Every process online sampling inspection

3. Chemical analysis

Chemical analysis to control online

chemical solutions

within control range

4. Physical Laboratory

To do reliability tests and outgoing inspection items

5. Micro-section

To analyze defects, every layer structure thickness, solder mask thickness, surface, and PTH copper thickness

6. Black Light Inspection

To analyze the PTH hole copper coverage before Panel copper plating

7. Lamination thickness measurement

To control the product thickness quality even distribution and thickness tolerance under
control

8. L/S measurement control by 3D

To control the products after Pattern plating within the design spec. ( Line width and Space width)

9. CMI measures copper thickness

CMI help to measure the PTH hole copper thickness and no need to damage the board by micro-section

10. Impedance measurement

For measuring Impedance control products ( Single strip, Differential …)

11. Peel strength test

Testing Solder Mask adhesive

12. X-ray monitor multi-layer drilling

It controls inner and outer layer registration

13. Hole AOI

To check hole location compare with Gerber design location accuracy

14. XRF measures Nickel & Gold thickness

To measure surface finishing metal thickness

15. Hi-Pot test

To checking the dielectric insulation capability

16. 100% O/S test

To check

circuit’s normal function as designed

circuit

17. Hole counter

To check missing holes

, hole size out the

spec., no excess holes

Reliability Test

Check Items

Equipment

Specification

Frequency

Purpose

△

DSC(Eternal)

△ Tg < 5℃

Once /month

Assure the lamination condition is OK

Surface insulation

SIR &Chamber

1.0X 1010Ω Min

2 Pcs /month

Assure the raw material condition is OK

Solderability

Solder Pot

ANSI / STD-J-003

Once / Shipping Lot

Assure the SMT wettability

Thermal Stress

Solder Pot

IPC-6012B

3Pcs / week
Important products

Assure the via-hole copper reliability

S/M Abrasion Test

6H Pencil

IPC-SM-840D

3Pcs / week

Assure the S/M curing is complete & quality

Via HoleTHK &
Dielectric THK

Microsection &
500X Microscope

IPC-6012B &
Customer spec.

Once / Shipping Lot

Assure the quality of the lamination and plating process

Impedance

Polar

Customer Spec.

Once / Shipping Lot

Assure the quality of Impedance

High Voltage

Hi-Pot

Customer Spec.

Once / Shipping Lot

Assure the quality of insulation