Quality Policy
- Quality, Efficiency, and Service
Environment Policy
- Strictly obey the legislation and regulations for pollution prevention.
- Continually improve the processes for saving resource usage.
- Progressively manufacture environment-protected products for the benefit of human society
Health and Safety Policy
- Strictly obey the legislation and regulations for employee health and safety.
- Continually create a healthy and safe working environment.
- Progressively prevent the potential risk of endangering health and safety.
Quality
- 100% visual inspection and electrical test
- Test data
- IPC
- Certification – ISO 9001
- XRF test data
- Solderability test
- Impedance modeling/testing
Items | Descriptions |
1. IQC | Incoming Quality Control for incoming raw material and Incoming Subcontract semi-products |
2. IPQC | In-process quality control, Every process online sampling inspection |
3. Chemical analysis | Chemical analysis to control online chemical solutionswithin control range |
4. Physical Laboratory | To do reliability tests and outgoing inspection items |
5. Micro-section | To analyze defects, every layer structure thickness, solder mask thickness, surface, and PTH copper thickness |
6. Black Light Inspection | To analyze the PTH hole copper coverage before Panel copper plating |
7. Lamination thickness measurement | To control the product thickness quality even distribution and thickness tolerance under |
8. L/S measurement control by 3D | To control the products after Pattern plating within the design spec. ( Line width and Space width) |
9. CMI measures copper thickness | CMI help to measure the PTH hole copper thickness and no need to damage the board by micro-section |
10. Impedance measurement | For measuring Impedance control products ( Single strip, Differential …) |
11. Peel strength test | Testing Solder Mask adhesive |
12. X-ray monitor multi-layer drilling | It controls inner and outer layer registration |
13. Hole AOI | To check hole location compare with Gerber design location accuracy |
14. XRF measures Nickel & Gold thickness | To measure surface finishing metal thickness |
15. Hi-Pot test | To checking the dielectric insulation capability |
16. 100% O/S test | To check circuit’s normal function as designedcircuit |
17. Hole counter | To check missing holes , hole size out thespec., no excess holes |
Reliability Test
Check Items | Equipment | Specification | Frequency | Purpose |
△ | DSC(Eternal) | △ Tg < 5℃ | Once /month | Assure the lamination condition is OK |
Surface insulation | SIR &Chamber | 1.0X 1010Ω Min | 2 Pcs /month | Assure the raw material condition is OK |
Solderability | Solder Pot | ANSI / STD-J-003 | Once / Shipping Lot | Assure the SMT wettability |
Thermal Stress | Solder Pot | IPC-6012B | 3Pcs / week | Assure the via-hole copper reliability |
S/M Abrasion Test | 6H Pencil | IPC-SM-840D | 3Pcs / week | Assure the S/M curing is complete & quality |
Via HoleTHK & | Microsection & | IPC-6012B & | Once / Shipping Lot | Assure the quality of the lamination and plating process |
Impedance | Polar | Customer Spec. | Once / Shipping Lot | Assure the quality of Impedance |
High Voltage | Hi-Pot | Customer Spec. | Once / Shipping Lot | Assure the quality of insulation |