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Finest Printed Circuit Board Ltd’s TurnKey PCB Assembly service offers a seamless and comprehensive solution for your printed circuit board needs. From design to delivery, we handle everything – component sourcing, fabrication, assembly, and rigorous testing. Our service ensures high-quality, customized PCBs with cost efficiency and rapid turnaround, ideal for a wide range of industries. Experience hassle-free PCB production that scales with your business.
Quick Turn PCB Assembly is your solution for fast-paced PCB manufacturing demands. Specializing in rapid production, we deliver high-quality printed circuit boards with exceptional speed. Ideal for urgent projects and prototypes, our service combines quick turnaround times with flexible order quantities, advanced assembly capabilities, and a commitment to quality. Accelerate your PCB production without compromising excellence.
Experience the future of electronics manufacturing with our Surface Mount Technology SMT Assembly service. Seamlessly integrating precision components onto printed circuit boards, our state-of-the-art process ensures top-notch quality and performance. From rapid prototyping to cost-effective large-scale production, trust us for efficient, customized solutions that meet the highest industry standards. Elevate your electronic devices with our SMT Assembly – where innovation and reliability converge for a seamless and reliable electronic assembly experience
Experience hassle-free PCB manufacturing with our Full Turnkey PCB Assembly Service. We handle it all – from design to delivery, component sourcing to rigorous testing. Streamline your production process and accelerate time-to-market with our comprehensive solution.” 1. Assembly Type: FR4, FPC, Rigid-flex PCB, Metal base PCB. 2. Assembly Specification: Min size L50″W50mm; Max size: L510*460mm 3. Assembly thickness: Min thickness: 0.2mm; Max thickness: 3.0mm Components DIP: 01005Chip/0.35 Pitch BGA Minimum device accurace: +/-0.04mm Minimum footprint distance: 0.3mm 4. Components Specification Components DIP: 01005Chip/0.35 Pitch BGA Minimum device accuracy: +/-0.04mm Minimum footprint distance: 0.3mm 5. File format: BOM list; PCB Gerber file: Click the PCBA capability in this link Get our categary