Metal substrates have been used since the 1960s, and were widely used in countries around the world in the 1980s and 1990s. What makes metal printed boards popular?
1. Thermal expansion
Thermal expansion and contraction are the common nature of materials, and different materials have different coefficients of thermal expansion. The metal substrate can effectively solve the heat dissipation problem, thereby alleviating the thermal expansion and contraction of different substances on the circuit board, and improving the durability and reliability of the whole machine and electronic equipment.
2. Heat dissipation
At present, many double-sided boards and multi-layer boards have high density and high power, and it is difficult to dissipate heat. Conventional circuit board substrates such as FR4 and CEM3 are poor thermal conductors, with interlayer insulation, and heat cannot be dissipated, resulting in high-temperature failure of electronic components. Metal-based printed boards can solve this heat dissipation problem.
3. Dimensional stability
The size of the metal substrate is obviously much more stable than that of the insulating material. Aluminum-based printed boards and aluminum sandwich panels are heated from 30°C to 140~150°C, with a size change of 2.5~3.0%.
4. Wide range of applications
The iron substrate has a shielding effect, can replace brittle ceramic substrates, replace components such as radiators, improve the heat resistance and physical properties of the product, and reduce production costs and labor.
The application of aluminum substrates is very wide, such as audio equipment input, output amplifiers, balanced amplifiers; computer CPU boards, floppy disk drives, power supply devices; automotive electronic regulators, igniters, power controllers; LED lights for lighting fixtures, etc. All use aluminum substrates.
The copper substrate is one of the more expensive metal substrates; compared with aluminum substrate because the material is relatively special, and the heat dissipation is relatively good, so it is relatively more expensive in terms of price, mainly suitable for high-frequency circuits and high-frequency circuits. Areas with large changes in low temperature and heat dissipation of precision communication equipment and architectural decoration industries.