The quality of PCB board is very important, so PCBA designers need to consider this from the beginning. In some PCBA processing, the quality of normal operation is defective. If the initial design sketch is not suitable, it is easy to damage the solder joints or electronic materials of the processed SMT components.
The pcba manufacturing should pay attention to these points:
1. BGA, chip capacitors, crystal oscillators, and other stress-sensitive devices are easily damaged by machinery or high temperature. Therefore, FINEST PCB believes that when designing or strengthening equipment, they should be placed on a PCB with higher hardness, or some methods should be used to avoid them in electronics PCB.
2. When PCB processes components, sensitive electronic components need to be arranged on a PCB with higher rigidity. In order to avoid damaging the sensitive electronic components of the PCB board during the assembly process, the connectors that fix the PCB board and the motherboard need to be placed on the side of the PCB daughter board, and the distance from the screw hole should not be too small, more than 10 mm.
3. In order to avoid BGA solder joint stress cracking, please avoid placing the BGA layout in a place that is easy to bend during PCB assembly. If you hold the circuit board with one hand, the poor design of the BGA can easily cause the solder joints to crack.
The above three points are mainly based on some discussions published in FINEST PCB years of R&D and design. In addition, it is important to reduce the pressure of assembly, adopt appropriate methods and tools, strengthen personnel training, and standardize operations.