Manual Soldering Problems in SMT Chip Processing Plants
In the production process of SMT small batch chip processing plants, some circuit boards or components need to be manually soldered for some reason. Soldering Problems in SMT chip processing is a very important part of the electronic processing and production process. If it is manual soldering, Only by achieving the same effect as the placement machine can we provide customers with high-quality processing services? In SMT patch processing, there are usually three manual soldering methods for two-end leadless chip components: soldering one by one, welding with special tools, and fast chip welding with flat chip soldering iron tips.
SMT processing factory shares the precautions for manual welding.
1. SMT patch processing. Check whether the absorbing sponge has water and is clean. If there is no water, please add an appropriate amount of water.
2. The human body and the soldering iron need to be grounded reliably, and the workshop operators of the SMT small-batch patch processing plant need to wear an electrostatic bracelet and be grounded.
3. Check whether the soldering iron is hot before starting the manual patch soldering. If it is not hot, first check whether the socket is plugged in. If it is plugged in, if it is not hot, report it to the administrator immediately. Do not disassemble the soldering iron at will, let alone use it. Touch the tip of the soldering iron directly with your hand.
4. in the SMT patch workshop, the oxidized uneven soldering tip needs to be updated in time to ensure a good heat conduction effect and circuit board soldering quality. The sponge used for welding needs to be cleaned. The contaminated sponge may contain metal particles or sulfur components, which will damage the soldering iron tip.
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