What are The Reasons for The Serious Heating of The Circuit Board?
There are many reasons for The Serious Heating of The Circuit Board. some of them as below that PCB manufacturers need to know:
1. Improper placement of components
There are some high-power devices that need to be reserved for natural ventilation or forced ventilation, mainly to dissipate heat. If there is no airflow to dissipate heat well, the PCB Board will accumulate most of the heat, causing the temperature to rise, which in turn leads to degradation or damage to the circuit performance. It should be noted that sensitive components cannot be placed around components that emit a large amount of heat. Proper heat dissipation and natural cooling or forced cooling should be performed to keep the temperature within a safe range.
2. Environment and external thermal factors
When applying pcb fabrication in extreme temperature environments, if the temperature conditions in the target environment are not considered during the design process, it is very likely that the electronic components will bear too much pressure; usually electronic component manufacturers will provide them at a specific temperature Appropriate specifications within the range.
3. Wrong parts and materials
In the process of selecting electronic component materials, if the usage guidelines are not followed, Multilayer PCB will likely cause heat dissipation problems. When selecting electronic components, it is important to check detailed data and consider all relevant information related to power consumption, thermal resistance, temperature limits, and cooling technology. In addition, when performing fast power calculations for resistors, make sure to select the rated power suitable for the application.
4. PCB design and manufacturing defects
Poor layout and manufacturing process can cause HDI PCB heat dissipation problems. Because incorrect soldering will affect heat dissipation, insufficient trace width or the copper area will also cause temperature rise. In order to solve the heat dissipation problem, designers must reduce heat dissipation and adopt other cooling techniques when natural cooling is insufficient; when conducting thermal optimization design, attention should be paid to component specifications, PCB layout, PCB dielectric materials, and environmental conditions.
